H10F 39/026
Wafer-level processing
Official title: {Wafer-level processing}
H10F39/026 (Wafer-level processing) appears on 3,066 US grants and 3,686 published applications in this corpus.
Search patents in H10F- Granted patents
- 3,066
- Published applications
- 3,686
- Assignees
- 564
- Inventors
- 4,100
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 11 | 0 |
| 2001 | 19 | 14 |
| 2002 | 21 | 33 |
| 2003 | 41 | 38 |
| 2004 | 36 | 72 |
| 2005 | 42 | 118 |
| 2006 | 49 | 151 |
| 2007 | 86 | 161 |
| 2008 | 94 | 207 |
| 2009 | 102 | 192 |
| 2010 | 153 | 203 |
| 2011 | 145 | 165 |
| 2012 | 134 | 166 |
| 2013 | 166 | 160 |
| 2014 | 205 | 183 |
| 2015 | 204 | 226 |
| 2016 | 221 | 280 |
| 2017 | 225 | 204 |
| 2018 | 212 | 184 |
| 2019 | 174 | 169 |
| 2020 | 165 | 172 |
| 2021 | 128 | 133 |
| 2022 | 96 | 105 |
| 2023 | 89 | 112 |
| 2024 | 89 | 125 |
| 2025 | 90 | 73 |
| 2026 | 48 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Three-layered stacked image sensor and method of manufacturing the same6 Oct 2026US 12,757,514 B2Samsung Electronics Co., Ltd.
- Solid-state imaging apparatus, manufacturing method thereof, and electronic equipment8 Sep 2026US 12,733,288 B2Sony Semiconductor Solutions Corporation
- Imaging device including a photoelectric converter and a capacitive element having a dielectric film sandwiched between electrodes and a mode switching transistor1 Sep 2026US 12,727,266 B2Panasonic Intellectual Property Management Co., Ltd.
- Method for forming backside illumination CMOS image sensor25 Aug 2026US 12,720,880 B2Hua Hong Semiconductor (Wuxi) Limited
- Back side illuminated image sensor with reduced sidewall-induced leakage25 Aug 2026US 12,720,881 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Stacked devices and methods of fabrication1 Oct 2026US 2026/0305491 A1Adeia Semiconductor Bonding Technologies Inc.
- Image sensor and image capture device24 Sep 2026US 2026/0293336 A1Nikon Corporation
- Integrated circuit device and method of manufacturing the same24 Sep 2026US 2026/0293353 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing photodetector, and photodetector17 Sep 2026US 2026/0282565 A1Hamamatsu Photonics K.K.
- Wafer level optical sensor packaging17 Sep 2026US 2026/0282574 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Sensor and image pickup device3,937US 7,453,065 B2Canon Kabushiki Kaisha · 2008
- Method for making three dimensional circuit integration485US 5,998,292 AInternational Business Machines Corporation · 1999
- Electronic apparatus comprising fingerprint sensing devices356US 6,327,376 B1U. S. Philips Corporation · 2001
- Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices287US 5,401,983 AGeorgia Tech Research Corporation · 1995
- Method for making backside illuminated image sensor236US 6,168,965 ATower Semiconductor Ltd. · 2001