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US 2026/0282574 A1Published application
Wafer level optical sensor packaging
AssigneeSTMicroelectronics International N.V.
InventorJing-En LUAN
Life of this patent
Estimating the term…
Abstract
A package includes a silicon integrated circuit substrate die including a die area for an optical function such as light sensing or light emitting. A micro-dam structure surrounds the die area. The micro-dam structure delimits a reservoir that is filled with a transparent material. An opaque material laterally encapsulates the micro-dam structure filled by the transparent material.
Claims23
A method, comprising:
- at each of a plurality of integrated circuit areas for a silicon integrated circuit substrate wafer, forming at least one micro-dam structure surrounding a die area, wherein each micro-dam structure delimits a reservoir;
- dispensing a transparent material to fill each reservoir;
- molding an opaque material to laterally encapsulate the micro-dam structures filled by the transparent material;
- and
- singulating the silicon integrated circuit substrate wafer to form a plurality of packages.
2 more elements
A package, comprising:
- a silicon integrated circuit substrate die including a die area;
- a micro-dam structure surrounding the die area, wherein the micro-dam structure delimits a reservoir;
- a transparent material filling the reservoir;
- and
- an opaque material laterally encapsulating the micro-dam structure filled by the transparent material.
2 more elements
Dependencies are inferred from the claim text.