Image sensor and image capture device

An image sensor comprising:

• a photoelectric conversion layer including a first substrate having (i) a first photoelectric conversion unit that converts light into a charge, (ii) a second photoelectric conversion unit that converts light into a charge and is arranged in line with the first photoelectric conversion unit in a first direction, and (iii) a third photoelectric conversion unit that converts light into a charge and is arranged in line with the first photoelectric conversion unit in a second direction intersecting the first direction;
• a first circuit layer including (a) a second substrate having (i) a first conversion unit that converts a first signal that is based on the charge converted by the first photoelectric conversion unit into a first digital signal, (ii) a second conversion unit that converts a second signal that is based on the charge converted by the second photoelectric conversion unit into a second digital signal, and (iii) a third conversion unit that converts a third signal that is based on the charge converted by the third photoelectric conversion unit into a third digital signal, and (b) a first connection layer that includes a first wiring electrically connected to a through electrode penetrating the second substrate, the first circuit layer being laminated together with the photoelectric conversion layer;
• a second circuit layer including (a) a third substrate including (i) a first control unit for performing a first calculation process on the first digital signal converted from the first signal by the first conversion unit, (ii) a second control unit for performing a second calculation process on the second digital signal converted from the second signal by the second conversion unit, and (iii) a third control unit for performing a third calculation process on the third digital signal converted from the third signal by the third conversion unit, and (b) a second connection layer that includes a second wiring electrically connected to a through electrode penetrating the third substrate, the second circuit layer being laminated together with the first circuit layer;
• and
• a first connection portion having electrode pads arranged so as to face each other in a direction in which the first circuit layer and the second circuit layer are stacked, the first connection portion being for electrically connecting the first wiring and the second wiring.