Solid-state imaging apparatus, manufacturing method thereof, and electronic equipment

Abstract

The present disclosure relates to a solid-state imaging apparatus, a manufacturing method thereof, and electronic equipment that are able to suppress nonuniform reflection of incident light. The solid-state imaging apparatus includes an imaging element chip and a device chip. The imaging element chip has a semiconductor substrate. The device chip is bonded to a wiring layer opposite the light incident surface of the semiconductor substrate. The device chip is disposed in a pixel region of the imaging element chip. The wiring layer of the imaging element chip includes a dummy metal wiring in a region where the device chip of the pixel region is not disposed. The technology according to the present disclosure is applicable, for example, to the solid-state imaging apparatus that is formed by bonding the imaging element chip to the device chip.

Dependencies are inferred from the claim text.