H10D 86/0214
Using temporary substrates
Official title: {using temporary substrates}
H10D86/0214 (Using temporary substrates) appears on 1,452 US grants and 1,655 published applications in this corpus.
Search patents in H10D- Granted patents
- 1,452
- Published applications
- 1,655
- Assignees
- 222
- Inventors
- 1,496
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 7 |
| 2002 | 9 | 14 |
| 2003 | 18 | 34 |
| 2004 | 17 | 46 |
| 2005 | 21 | 55 |
| 2006 | 29 | 72 |
| 2007 | 36 | 110 |
| 2008 | 51 | 121 |
| 2009 | 63 | 131 |
| 2010 | 124 | 108 |
| 2011 | 130 | 116 |
| 2012 | 118 | 63 |
| 2013 | 109 | 59 |
| 2014 | 68 | 52 |
| 2015 | 78 | 69 |
| 2016 | 71 | 66 |
| 2017 | 53 | 70 |
| 2018 | 49 | 76 |
| 2019 | 69 | 61 |
| 2020 | 70 | 55 |
| 2021 | 57 | 78 |
| 2022 | 42 | 48 |
| 2023 | 39 | 41 |
| 2024 | 42 | 46 |
| 2025 | 31 | 47 |
| 2026 | 13 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enlarged overlap between backside power rail and backside contact6 Oct 2026US 12,757,489 B2International Business Machines Corporation
- Integration of stacked logic device with passive device15 Sep 2026US 12,740,150 B2International Business Machines Corporation
- Stacked FET with local contact8 Sep 2026US 12,733,261 B2International Business Machines Corporation
- Backside diffusion break1 Sep 2026US 12,727,243 B2International Business Machines Corporation
- Heat dissipation in semiconductor devices28 Jul 2026US 12,696,763 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Liquid crystal display device and manufacturing method thereof8 Oct 2026US 2026/0310017 A1Semiconductor Energy Laboratory Co.Ltd.
- Heat dissipation in semiconductor devices8 Oct 2026US 2026/0314410 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Production method of semiconductor device17 Sep 2026US 2026/0282554 A1Tokyo Electron Limited
- Display device, display module, and electronic device27 Aug 2026US 2026/0255681 A1Semiconductor Energy Laboratory Co.Ltd.
- Carrier substrate structure and method of manufacturing integrated circuit device using the same13 Aug 2026US 2026/0239737 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method924US 6,372,608 B1Seiko Epson Corporation · 2002
- Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same714US 6,645,830 B2Seiko Epson Corporation · 2003
- Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same674US 6,818,530 B2Seiko Epson Corporation · 2004
- Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bonding580US 5,821,138 ASemiconductor Energy Laboratory Co.Ltd. · 1998
- Single crystal silicon arrayed devices for display panels540US 5,317,236 AKopin Corporation · 1994