Integration of stacked logic device with passive device
AssigneeInternational Business Machines Corporation
InventorsLijuan Zou, Tao Li, Ruilong Xie, Anthony I. Chou
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AssigneeInternational Business Machines Corporation
InventorsLijuan Zou, Tao Li, Ruilong Xie, Anthony I. Chou
Estimating the term…
Embodiments of present invention provide a semiconductor structure. The structure includes an active device region and a passive device region, the active device region and the passive device region being separated by a single diffusion break, where the passive device region includes a first passive device. The first passive device includes a first diffusion region and a second diffusion region, the first and the second diffusion region being vertically connected by a lightly doped region, where the first diffusion region is connected to a backside power distribution network through a first direct backside contact (BSCA) and the second diffusion region is connected to a back-end-of-line (BEOL) structure through a first middle-of-line contact. A method of forming the same is also provided.
A semiconductor structure comprising:
A method of forming a semiconductor structure comprising:
A semiconductor structure comprising:
Dependencies are inferred from the claim text.