H10D 84/991
Latch-up prevention
Official title: {Latch-up prevention}
H10D84/991 (Latch-up prevention) appears on 30 US grants and 37 published applications in this corpus.
Search patents in H10D- Granted patents
- 30
- Published applications
- 37
- Assignees
- 11
- Inventors
- 41
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 1 | 1 |
| 2016 | 1 | 2 |
| 2017 | 2 | 3 |
| 2018 | 1 | 2 |
| 2019 | 1 | 2 |
| 2020 | 6 | 5 |
| 2021 | 3 | 4 |
| 2022 | 2 | 3 |
| 2023 | 3 | 5 |
| 2024 | 2 | 1 |
| 2025 | 4 | 0 |
| 2026 | 2 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit structure and method of forming the same30 Jun 2026US 12,672,344 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method and system for manufacturing integrated circuit device6 Jan 2026US 12,520,579 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor layout in FinFET technologies21 Oct 2025US 12,450,418 B2Apple Inc.
- Integrated circuit including asymmetric ending cells and system-on-chip including the same21 Oct 2025US 12,453,177 B2Samsung Electronics Co., Ltd.
- Latch-up free high voltage device23 Sep 2025US 12,426,362 B2Halo Microelectronics International
- Integrated circuit structure and method of forming the same8 Oct 2026US 2026/0314040 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit device2 Apr 2026US 2026/0096207 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of fabricating the same5 Mar 2026US 2026/0068317 A1Samsung Electronics Co., Ltd.
- Semiconductor layout in finfet technologies22 Jan 2026US 2026/0023912 A1Apple Inc.
- Latch-up Free High Voltage Device15 Jan 2026US 2026/0020342 A1Halo Microelectronics International
Most cited
By later US patents
- Semiconductor device6US 8,692,336 B2Panasonic Corporation · 2014
- Semiconductor layout in FinFET technologies3US 10,740,527 B2Apple Inc. · 2020
- Latch-up immunization techniques for integrated circuits2US 10,930,650 B2STMicroelectronics International N. V. · 2021
- Semiconductor device2US 8,946,826 B2Panasonic Corporation · 2015
- Flip chip backside die grounding techniques1US 10,607,958 B2Texas Instruments Incorporated · 2020