H10D 84/0188
Manufacturing their isolation regions
Official title: {Manufacturing their isolation regions}
H10D84/0188 (Manufacturing their isolation regions) appears on 3,642 US grants and 4,422 published applications in this corpus.
Search patents in H10D- Granted patents
- 3,642
- Published applications
- 4,422
- Assignees
- 387
- Inventors
- 4,789
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 7 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 18 | 0 |
| 2000 | 27 | 0 |
| 2001 | 24 | 8 |
| 2002 | 43 | 36 |
| 2003 | 36 | 37 |
| 2004 | 40 | 61 |
| 2005 | 44 | 100 |
| 2006 | 54 | 122 |
| 2007 | 77 | 158 |
| 2008 | 95 | 206 |
| 2009 | 111 | 110 |
| 2010 | 147 | 93 |
| 2011 | 115 | 78 |
| 2012 | 85 | 93 |
| 2013 | 92 | 90 |
| 2014 | 98 | 91 |
| 2015 | 106 | 133 |
| 2016 | 165 | 178 |
| 2017 | 208 | 214 |
| 2018 | 225 | 221 |
| 2019 | 247 | 262 |
| 2020 | 273 | 320 |
| 2021 | 214 | 244 |
| 2022 | 196 | 273 |
| 2023 | 213 | 361 |
| 2024 | 209 | 323 |
| 2025 | 225 | 355 |
| 2026 | 170 | 255 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- 3D-stacked semiconductor device including middle isolation structure and BSPDN structure6 Oct 2026US 12,757,485 B2Samsung Electronics Co., Ltd.
- Isolation features for semiconductor devices and methods of fabricating the same29 Sep 2026US 12,751,075 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method thereof29 Sep 2026US 12,751,273 B2National Yang Ming.Chiao Tung University
- Semiconductor structure with hard mask and method for manufacturing the same22 Sep 2026US 12,745,412 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device22 Sep 2026US 12,745,451 B2Samsung Electronics Co., Ltd.
- FINFET Devices with Backside Power Rail and Backside Self-Aligned Via8 Oct 2026US 2026/0313945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure including bottom isolation and method for manufacturing the same8 Oct 2026US 2026/0313965 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof8 Oct 2026US 2026/0313988 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of forming semiconductor device8 Oct 2026US 2026/0314034 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device including cutting pattern8 Oct 2026US 2026/0314057 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method of cutting metal gate3,322US 9,520,482 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- FinFET devices with unique fin shape and the fabrication thereof1,337US 9,548,303 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Vertical gate all around (VGAA) devices and methods of manufacturing the same987US 9,536,738 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Strained structure of semiconductor device and method of making the strained structure614US 9,171,929 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Semiconductor method and device with mixed orientation substrate566US 7,298,009 B2Infineon Technologies AG · 2007