H10D 48/04
Of devices having bodies comprising selenium or tellurium in uncombined form
Official title: of devices having bodies comprising selenium or tellurium in uncombined form
H10D48/04 (Of devices having bodies comprising selenium or tellurium in uncombined form) appears on 54 US grants and 62 published applications in this corpus.
Search patents in H10D- Granted patents
- 54
- Published applications
- 62
- Assignees
- 42
- Inventors
- 154
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 2 | 2 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 4 |
| 2013 | 4 | 4 |
| 2014 | 4 | 3 |
| 2015 | 3 | 4 |
| 2016 | 2 | 3 |
| 2017 | 1 | 2 |
| 2018 | 6 | 8 |
| 2019 | 5 | 7 |
| 2020 | 5 | 5 |
| 2021 | 4 | 3 |
| 2022 | 3 | 5 |
| 2023 | 0 | 1 |
| 2024 | 3 | 5 |
| 2025 | 3 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Lamp heating module for an epitaxy process chamber16 Jun 2026US 12,660,554 B2APPLIED Materials.Inc.
- Vapor deposition of tellurium nanomesh electronics on arbitrary surfaces at low temperature3 Feb 2026US 12,543,518 B2City University of Hong Kong
- Circuit board and method for manufacturing the same, functional backplate, backlight module and display apparatus14 Oct 2025US 12,446,151 B2Boe Technology Group Co., Ltd.
- Semiconductor devices including a support pattern on a lower electrode structure18 Mar 2025US 12,255,065 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method for forming semiconductor device18 Mar 2025US 12,256,535 B2Changxin Memory Technologies, Inc.
- Multi-zone lamp heating and temperature monitoring in epitaxy process chamber31 Jul 2025US 2025/0246461 A1APPLIED Materials.Inc.
- Semiconductor substrate manufacturing method, semiconductor substrate, and semiconductor substrate manufacturing apparatus19 Sep 2024US 2024/0312779 A1Filnex Inc.
- Circuit board and method for manufacturing the same, functional backplate,backlight module and display apparatus1 Aug 2024US 2024/0260185 A1Boe Technology Group Co., Ltd.
- Semiconductor devices including a support pattern on a lower electrode structure11 Apr 2024US 2024/0120196 A1Samsung Electronics Co., Ltd.
- Vapor deposition of tellurium nanomesh electronics on arbitrary surfaces at low temperature7 Mar 2024US 2024/0079234 A1City University of Hong Kong
Most cited
By later US patents
- Semiconductor device packages and stacked package assemblies including high density interconnections31US 10,276,382 B2Advanced Semiconductor Engineering, Inc. · 2019
- Resistive switching devices and methods of formation thereof15US 8,941,089 B2Adesto Technologies Corporation · 2015
- Memory cell constructions, and methods for fabricating memory cell constructions14US 8,735,216 B2Micron Technology, Inc. · 2014
- Composite target sputtering for forming doped phase change materials11US 8,426,242 B2International Business Machines Corporation · 2013
- Activation of oxides for electroless plating10US 6,900,128 B2Micron Technology, Inc. · 2005