H10D 48/043
Preliminary treatment of the selenium or tellurium, its application to foundation plates
Official title: Preliminary treatment of the selenium or tellurium, its application to foundation plates or the subsequent treatment of the combination
H10D48/043 (Preliminary treatment of the selenium or tellurium, its application to foundation plates) appears on 18 US grants and 21 published applications in this corpus.
Search patents in H10D- Granted patents
- 18
- Published applications
- 21
- Assignees
- 12
- Inventors
- 45
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 2 | 2 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 3 | 1 |
| 2019 | 2 | 3 |
| 2020 | 1 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 4 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Lamp heating module for an epitaxy process chamber16 Jun 2026US 12,660,554 B2APPLIED Materials.Inc.
- Semiconductor device and method for forming semiconductor device18 Mar 2025US 12,256,535 B2Changxin Memory Technologies, Inc.
- DRAM semiconductor structure formation method and DRAM semiconductor structure9 Apr 2024US 11,956,944 B2Changxin Memory Technologies, Inc.
- Transistor structure with a stress layer31 May 2022US 11,349,003 B2Cambridge Electronics, Inc.
- Semiconductor device packages and stacked package assemblies including high density interconnections9 Feb 2021US 10,916,429 B2Advanced Semiconductor Engineering, Inc.
- Multi-zone lamp heating and temperature monitoring in epitaxy process chamber31 Jul 2025US 2025/0246461 A1APPLIED Materials.Inc.
- Wide bandgap oxide nanostructure anti-glare coating and use thereof22 Dec 2022US 2022/0404528 A1
- Multi-zone lamp heating and temperature monitoring in epitaxy process chamber17 Nov 2022US 2022/0367216 A1APPLIED Materials.Inc.
- Semiconductor device and method for forming semiconductor device17 Nov 2022US 2022/0367477 A1Changxin Memory Technologies, Inc.
- Semiconductor structure formation method and semiconductor structure28 Apr 2022US 2022/0130833 A1Changxin Memory Technologies, Inc.
Most cited
By later US patents
- Semiconductor device packages and stacked package assemblies including high density interconnections31US 10,276,382 B2Advanced Semiconductor Engineering, Inc. · 2019
- Activation of oxides for electroless plating10US 6,900,128 B2Micron Technology, Inc. · 2005
- Activation of oxides for electroless plating9US 6,872,659 B2Micron Technology, Inc. · 2005
- Semiconductor device packages and stacked package assemblies including high density interconnections6US 10,535,521 B2Advanced Semiconductor Engineering, Inc. · 2020
- Semiconductor device packages and stacked package assemblies including high density interconnections5US 10,515,806 B2Advanced Semiconductor Engineering, Inc. · 2019