H10D 48/046
Provision of discrete insulating layers
H10D48/046 (Provision of discrete insulating layers) appears on 7 US grants and 8 published applications in this corpus.
Search patents in H10D- Granted patents
- 7
- Published applications
- 8
- Assignees
- 3
- Inventors
- 14
- Latest grant
- 18 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 0 | 1 |
| 2019 | 2 | 2 |
| 2020 | 1 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 3 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
| 2025 | 1 | 0 |
By publication year.
Recent patents
- Semiconductor device and method for forming semiconductor device18 Mar 2025US 12,256,535 B2Changxin Memory Technologies, Inc.
- DRAM semiconductor structure formation method and DRAM semiconductor structure9 Apr 2024US 11,956,944 B2Changxin Memory Technologies, Inc.
- Transistor structure with a stress layer31 May 2022US 11,349,003 B2Cambridge Electronics, Inc.
- Semiconductor device packages and stacked package assemblies including high density interconnections9 Feb 2021US 10,916,429 B2Advanced Semiconductor Engineering, Inc.
- Semiconductor device packages and stacked package assemblies including high density interconnections14 Jan 2020US 10,535,521 B2Advanced Semiconductor Engineering, Inc.
- Wide bandgap oxide nanostructure anti-glare coating and use thereof22 Dec 2022US 2022/0404528 A1
- Semiconductor device and method for forming semiconductor device17 Nov 2022US 2022/0367477 A1Changxin Memory Technologies, Inc.
- Semiconductor structure formation method and semiconductor structure28 Apr 2022US 2022/0130833 A1Changxin Memory Technologies, Inc.
- Transistor Structure With A Stress Layer19 Nov 2020US 2020/0365394 A1Cambridge Electronics, Inc.
- Semiconductor device packages and stacked package assemblies including high density interconnections9 Apr 2020US 2020/0111671 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Semiconductor device packages and stacked package assemblies including high density interconnections31US 10,276,382 B2Advanced Semiconductor Engineering, Inc. · 2019
- Semiconductor device packages and stacked package assemblies including high density interconnections6US 10,535,521 B2Advanced Semiconductor Engineering, Inc. · 2020
- Semiconductor device packages and stacked package assemblies including high density interconnections5US 10,515,806 B2Advanced Semiconductor Engineering, Inc. · 2019
- Semiconductor device packages and stacked package assemblies including high density interconnections1US 10,916,429 B2Advanced Semiconductor Engineering, Inc. · 2021