Semiconductor structure formation method and semiconductor structure
AssigneeChangxin Memory Technologies, Inc.
InventorsLongyang CHEN, Hongfa Wu, Gongyi Wu
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AssigneeChangxin Memory Technologies, Inc.
InventorsLongyang CHEN, Hongfa Wu, Gongyi Wu
Estimating the term…
Embodiments of the present application provide a semiconductor structure formation method and a semiconductor structure. The method includes: the substrate including contact region and dummy region, a first bitline structure and a first dielectric layer being formed on the substrate, the first bitline structure and the first dielectric layer defining discrete capacitor contact openings; forming a first sacrificial layer filling the capacitor contact opening; removing, in the dummy region, part of height of the first bitline structure, part of height of the first dielectric layer and part of height of the first sacrificial layer to form a first opening located at top of a second bitline structure, a second dielectric layer and a second sacrificial layer; forming an insulation layer filling the first opening; removing, in the contact region, the first sacrificial layer to form a second opening; and forming a capacitor contact structure located in the second opening.
A semiconductor structure formation method, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.