Memory cell constructions, and methods for fabricating memory cell constructions
AssigneeMicron Technology, Inc.
InventorsJun Liu, Jian Li
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorsJun Liu, Jian Li
Estimating the term…
Some embodiments include methods for fabricating memory cell constructions. A memory cell may be formed to have a programmable material directly against a material having a different coefficient of expansion than the programmable material. A retaining shell may be formed adjacent the programmable material. The memory cell may be thermally processed to increase a temperature of the memory cell to at least about 300° C., causing thermally-induced stress within the memory cell. The retaining shell may provide a stress which substantially balances the thermally-induced stress. Some embodiments include memory cell constructions. The constructions may include programmable material directly against silicon nitride that has an internal stress of less than or equal to about 200 megapascals. The constructions may also include a retaining shell silicon nitride that has an internal stress of at least about 500 megapascals.
A method for fabricating a memory cell construction, comprising:
A method for fabricating a memory cell construction, comprising:
Dependencies are inferred from the claim text.