H10B 80/00
Assemblies of multiple devices comprising at least one memory device covered by
Official title: Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by) appears on 578 US grants and 3,062 published applications in this corpus.
Search patents in H10B- Granted patents
- 578
- Published applications
- 3,062
- Assignees
- 201
- Inventors
- 4,346
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 0 | 1 |
| 2019 | 1 | 1 |
| 2020 | 1 | 5 |
| 2021 | 3 | 6 |
| 2022 | 1 | 14 |
| 2023 | 27 | 227 |
| 2024 | 49 | 753 |
| 2025 | 139 | 985 |
| 2026 | 357 | 1070 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit package and method of manufacturing the same6 Oct 2026US 12,754,862 B2SK hynix Inc.
- Semiconductor assembly gap filler6 Oct 2026US 12,757,337 B2Micron Technology, Inc.
- Semiconductor storage device6 Oct 2026US 12,757,341 B2Kioxia Corporation
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Semiconductor memory device6 Oct 2026US 12,757,413 B2Samsung Electronics Co., Ltd.
- Hbm power up protection scheme design8 Oct 2026US 2026/0311738 A1Micron Technology, Inc.
- Memory device with alternating metal lines8 Oct 2026US 2026/0313866 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices including global bitlines8 Oct 2026US 2026/0313881 A1Samsung Electronics Co., Ltd.
- Semiconductor device including capacitors, word line pads and word line contacts8 Oct 2026US 2026/0313882 A1Samsung Electronics Co., Ltd.
- Three-dimensional memory device with overlapped staircases and methods for forming the same8 Oct 2026US 2026/0313893 A1SanDisk Technologies LLC
Most cited
By later US patents
- 3D stack of accelerator die and multi-core processor die31US 11,694,940 B1Kepler Computing Inc. · 2023
- Embedded pad structures of three-dimensional memory devices and fabrication methods thereof16US 10,930,661 B2Yangtze Memory Technologies Co., Ltd. · 2021
- Hybrid integrated circuit package and method9US 10,867,982 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2020
- Metal-free frame design for silicon bridges for semiconductor packages7US 10,916,514 B2Intel Corporation · 2021
- Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip6US 11,616,046 B2iCometrue Company Ltd. · 2023