Hybrid integrated circuit package and method

A method comprising:

• forming a waveguide over a carrier substrate;
• depositing a first dielectric layer over and around the waveguide;
• plating conductive lines from a first side of the first dielectric layer;
• removing the carrier substrate to expose the waveguide and a second side of the first dielectric layer;
• forming conductive features extending through the first dielectric layer to couple the conductive lines;
• attaching a first photonic die and a second photonic die to the waveguide and the second side of the first dielectric layer;
• and
• attaching a first integrated circuit die and a second integrated circuit die to the conductive features and the second side of the first dielectric layer.

A method comprising:

• forming a hybrid redistribution structure comprising:
• forming a waveguide on a carrier substrate;
• depositing a first dielectric layer over and around the waveguide;
• forming conductive features extending through the first dielectric layer and along a major surface of the first dielectric layer;
• and
• depositing a second dielectric layer over the conductive features and the major surface of the first dielectric layer;
• after forming the hybrid redistribution structure, attaching a first photonic die and a second photonic die to the hybrid redistribution structure, the first photonic die being optically coupled to the second photonic die by the waveguide;
• and
• attaching a first integrated circuit die and a second integrated circuit die to the hybrid redistribution structure, the first integrated circuit die being electrically coupled to the first photonic die by the conductive features, the second integrated circuit die being electrically coupled to the second photonic die by the conductive features.