H05K 7/20454
With a conformable or flexible structure compensating for irregularities
Official title: {with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste}
H05K7/20454 (With a conformable or flexible structure compensating for irregularities) appears on 245 US grants and 327 published applications in this corpus.
Search patents in H05K- Granted patents
- 245
- Published applications
- 327
- Assignees
- 211
- Inventors
- 876
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 4 |
| 2004 | 2 | 3 |
| 2005 | 2 | 2 |
| 2006 | 2 | 2 |
| 2007 | 0 | 3 |
| 2008 | 0 | 4 |
| 2009 | 1 | 5 |
| 2010 | 3 | 7 |
| 2011 | 6 | 8 |
| 2012 | 2 | 9 |
| 2013 | 4 | 9 |
| 2014 | 6 | 10 |
| 2015 | 6 | 7 |
| 2016 | 5 | 15 |
| 2017 | 9 | 7 |
| 2018 | 15 | 14 |
| 2019 | 14 | 22 |
| 2020 | 21 | 25 |
| 2021 | 19 | 23 |
| 2022 | 16 | 27 |
| 2023 | 25 | 30 |
| 2024 | 17 | 35 |
| 2025 | 24 | 30 |
| 2026 | 14 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System for attaching a thermal interface material to a heat sink8 Sep 2026US 12,733,106 B2Dell Products L. P.
- Electronic device comprising printed circuit board structure accommodating thermal interface material11 Aug 2026US 12,707,601 B2Samsung Electronics Co., Ltd.
- Integration of systems comprising standard electronic components in satellites14 Jul 2026US 12,684,736 B2Unseenlabs
- Thermal management system including an overmolded layer and a conductive layer over a circuit board14 Jul 2026US 12,684,743 B2Lunar Energy, Inc.
- Electronic control device30 Jun 2026US 12,672,266 B2Hitachi Astemo, Ltd.
- Control apparatus for vehicle1 Oct 2026US 2026/0304712 A1Hyundai Mobis Co., Ltd.
- System for Attaching a Thermal Interface Material to a Heat Sink24 Sep 2026US 2026/0292996 A1Dell Products L. P.
- Liquid cooling system17 Sep 2026US 2026/0282275 A1Inventec Corporation
- Liquid heat conduction material, combination of members for producing heat conduction sheet, heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheet3 Sep 2026US 2026/0262199 A1Resonac Corporation
- Three-dimensional (3d) thermal joints including rheology controlled thermal interface materials (tims)27 Aug 2026US 2026/0255547 A1Laird Technologies, Inc.
Most cited
By later US patents
- Conformable pad with thermally conductive additive for heat dissipation179US 5,060,114 AZenith Electronics Corporation · 1991
- Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof95US 6,444,496 B1International Business Machines Corporation · 2002
- Systems structures and materials for electronic device cooling91US 8,587,945 B1Outlast Technologies, Inc. · 2013
- Thermal link85US 4,654,754 AFairchild Weston Systems, Inc. · 1987
- Cooling approach for high power integrated circuits mounted on printed circuit boards63US 5,768,104 ACray Research, Inc. · 1998