H05K 7/2039
Characterised by the heat transfer by conduction from the heat generating element
Official title: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
H05K7/2039 (Characterised by the heat transfer by conduction from the heat generating element) appears on 4,995 US grants and 6,591 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,995
- Published applications
- 6,591
- Assignees
- 1,959
- Inventors
- 12,596
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 7 | 0 |
| 1985 | 8 | 0 |
| 1986 | 13 | 0 |
| 1987 | 12 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 10 | 0 |
| 1991 | 10 | 0 |
| 1992 | 6 | 0 |
| 1993 | 12 | 0 |
| 1994 | 16 | 0 |
| 1995 | 18 | 0 |
| 1996 | 11 | 0 |
| 1997 | 7 | 0 |
| 1998 | 25 | 0 |
| 1999 | 36 | 0 |
| 2000 | 38 | 0 |
| 2001 | 32 | 8 |
| 2002 | 29 | 31 |
| 2003 | 32 | 36 |
| 2004 | 38 | 31 |
| 2005 | 20 | 52 |
| 2006 | 32 | 56 |
| 2007 | 48 | 71 |
| 2008 | 41 | 98 |
| 2009 | 38 | 87 |
| 2010 | 54 | 100 |
| 2011 | 57 | 104 |
| 2012 | 59 | 115 |
| 2013 | 79 | 215 |
| 2014 | 100 | 258 |
| 2015 | 165 | 310 |
| 2016 | 238 | 267 |
| 2017 | 271 | 300 |
| 2018 | 311 | 434 |
| 2019 | 371 | 382 |
| 2020 | 393 | 446 |
| 2021 | 342 | 495 |
| 2022 | 362 | 535 |
| 2023 | 383 | 590 |
| 2024 | 451 | 633 |
| 2025 | 485 | 527 |
| 2026 | 297 | 410 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 7/20436Inner thermal coupling elements in heat dissipating housings1,893
- H05K 7/20409Outer radiating structures on heat dissipating housings1,163
- H05K 7/20509Multiple-component heat spreaders795
- H05K 7/205Heat-dissipating body thermally connected to heat generating element via thermal paths through345
- H05K 7/20518Unevenly distributed heat load134
Recent patents
- Cold plate and method for manufacturing cold plate6 Oct 2026US 12,753,978 B2Fujikura Ltd.
- Connector assembly with improved heat dissipation effect6 Oct 2026US 12,756,145 B2Dongguan Luxshare Technologies Co., Ltd
- Semiconductor assembly gap filler6 Oct 2026US 12,757,337 B2Micron Technology, Inc.
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- System and method for a smart power module6 Oct 2026US 12,757,356 B2
- Antenna structure and electronic device8 Oct 2026US 2026/0312281 A1Wistron Neweb Corp.
- Electrical connection unit8 Oct 2026US 2026/0312347 A1Yazaki Corporation
- Servicing system for server cassettes8 Oct 2026US 2026/0313823 A1
- Extended Heatsink with Liquid Cooling System8 Oct 2026US 2026/0313846 A1Liquacool IP LLC
- Integrated diamond manifold microchannel heat sink structure and manufacturing method thereof8 Oct 2026US 2026/0313847 A1Xi' An Jiaotong University
Most cited
By later US patents
- Electronic device806US 9,313,915 B2ASUSTek · 2016
- Photovoltaic connection system281US 7,291,036 B1Tyco Electronics Corporation · 2007
- Optical network unit215US 5,267,122 AAlcatel Network Systems, Inc. · 1993
- Thermal management for head-worn computer199US 9,423,842 B2Osterhout Group, Inc. · 2016
- Pluggable electronic module and receptacle with heat sink183US 6,816,376 B2Tyco Electronics Corporation · 2004