Extended Heatsink with Liquid Cooling System

A hybrid cooling system coupled to a printed circuit board to provide cooling for a component mounted on the printed circuit board, the hybrid cooling system comprising:

• an extended heatsink coupled to the printed circuit board to form a sealed chamber with the printed circuit board, the extended heatsink comprising a heatsink with a skirt extending from the heatsink, the skirt coupled to the printed circuit board, the extended heatsink having an interior surface and an exterior surface;
• a plurality of contact areas on the interior surface of the extended heatsink, each of the plurality of contact areas designed to be in direct physical contact with a top of a corresponding component, to provide direct contact cooling to the corresponding component;
• a transfer fluid within the sealed chamber and contacting other areas of the component mounted on the printed circuit board to provide liquid cooling for the component;
• and
• a bladder filled with a gas within the sealed chamber, wherein the bladder expands and contracts to facilitate a balance of pressure within a sealed chamber.

A hybrid cooling system coupled to a printed circuit board to provide cooling for a component mounted on the printed circuit board, the hybrid cooling system comprising:

• a silk screen layer to label components on the printed circuit board and to provide a silk screen path for a gasket;
• an extended heatsink coupled to the printed circuit board to form a sealed chamber with the printed circuit board, the a gasket sealing the extended heatsink to the silk screen path on the printed circuit board, the silk screen path forming a smooth surface over PCB traces for sealing with the gasket, and the silk screen path and the gasket forming a liquid barrier;
• the extended heatsink comprising a heatsink with a skirt extending from the heatsink, the skirt coupled to the printed circuit board, the extended heatsink having an interior surface and an exterior surface;
• a contact area on the interior surface of the extended heatsink, the contact area designed to be in direct physical contact with a top of the component, to provide direct contact cooling to the component;
• a transfer fluid within the sealed chamber and contacting other areas of the component mounted on the printed circuit board to provide liquid cooling for the component;
• the extended heatsink comprising a double sided extended heatsink with a first portion on a top of the printed circuit board and a second portion on a bottom of the printed circuit board, wherein one or both of the first portion and the second portion have the contact area on the interior surface;
• and
• through-holes in the printed circuit board to allow the transfer fluid to circulate between the first portion and the second portion of the extended heatsink.