Integrated diamond manifold microchannel heat sink structure and manufacturing method thereof

Abstract

An integrated diamond manifold microchannel heat sink structure and a manufacturing method thereof are provided. The heat sink structure includes a microchannel structure, a manifold structure and a manifold plate. The manifold structure and microchannel structure are integrated on a diamond substrate. The microchannel structure is connected to the manifold structure, and a microchannel structure surface is sealed. The manifold structure is connected to the manifold plate. The manifold plate is defined with flow-guiding structures penetrating therethrough. The heat sink structure features fewer heterogeneous interfaces. During fabrication, the manifold structure and microchannel structure are fabricated on two opposite sides of the diamond substrate using an ultraviolet nanosecond laser processing system, followed by epitaxial lateral growth of the diamond on the microchannel structure surface via microwave plasma chemical vapor deposition until tops of microchannels are sealed. The manifold plate is bonded to an upper surface of the manifold structure by brazing.

Dependencies are inferred from the claim text.