H05K 7/20509
Multiple-component heat spreaders
Official title: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
H05K7/20509 (Multiple-component heat spreaders) appears on 795 US grants and 938 published applications in this corpus.
Search patents in H05K- Granted patents
- 795
- Published applications
- 938
- Assignees
- 465
- Inventors
- 2,160
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 14 | 0 |
| 2000 | 13 | 0 |
| 2001 | 12 | 2 |
| 2002 | 8 | 7 |
| 2003 | 9 | 4 |
| 2004 | 8 | 6 |
| 2005 | 2 | 3 |
| 2006 | 1 | 5 |
| 2007 | 7 | 9 |
| 2008 | 5 | 16 |
| 2009 | 4 | 13 |
| 2010 | 7 | 13 |
| 2011 | 8 | 8 |
| 2012 | 8 | 27 |
| 2013 | 16 | 32 |
| 2014 | 18 | 29 |
| 2015 | 23 | 58 |
| 2016 | 37 | 41 |
| 2017 | 38 | 44 |
| 2018 | 39 | 47 |
| 2019 | 58 | 61 |
| 2020 | 57 | 76 |
| 2021 | 60 | 78 |
| 2022 | 60 | 96 |
| 2023 | 70 | 80 |
| 2024 | 71 | 84 |
| 2025 | 54 | 46 |
| 2026 | 46 | 53 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Cold plate and method for manufacturing cold plate6 Oct 2026US 12,753,978 B2Fujikura Ltd.
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Thermal-control system of a mesh network device and associated mesh network devices29 Sep 2026US 12,750,945 B2Google Inc.
- Clamped annealed pyrolytic graphite heat spreading29 Sep 2026US 12,750,979 B2Raytheon Company
- Battery charging and discharging system including peltier element, and temperature control method of battery charging and discharging using the same15 Sep 2026US 12,738,755 B2LG Energy Solution, Ltd.
- Data throughput using a metal bracket8 Oct 2026US 2026/0313848 A1Micron Technology, Inc.
- Multilayer back plate with molded ceramic layer8 Oct 2026US 2026/0313849 A1Intel Corporation
- Vertical power supply assembly and smart card assembly with integrated heat sink1 Oct 2026US 2026/0299657 A1MetaPWR Electronics Co., Ltd.
- Cooling of electronic components in electronics servers1 Oct 2026US 2026/0304688 A1AMD Design, LLC
- Systems and methods for microfluidic thermal management24 Sep 2026US 2026/0293048 A1Microsoft Technology Licensing, LLC
Most cited
By later US patents
- Stacked configuration for integrated circuit devices177US 5,117,282 AHarris Corporation · 1992
- Pluggable electronic circuit package assembly with snap together heat sink housing143US 5,109,318 AInternational Business Machines Corporation · 1992
- Inter-circuit encapsulated packaging132US 6,304,450 B1INCEP Technologies, Inc. · 2001
- Embossed heat spreader112US 8,081,474 B1Google Inc. · 2011
- Printed circuit board heat sink107US 4,979,074 AFlavors Technology Inc. · 1990