Embossed heat spreader
AssigneeGoogle Inc.
InventorsWael O. Zohni, William L. Schmidt, Michael John Sebastian Smith, Jeremy Matthew Plunkett
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Abstract
One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.
Claims39
An apparatus comprising:
- a printed circuit board (PCB);
- electronic components disposed on the PCB;
- a thermal interface material (TIM) thermally coupled to the electronic components;
- and
- a heat spreader plate with a surface thermally coupled to the TIM, the surface of the heat spreader plate having edges and an embossed pattern with embossed segments having open ends;
- wherein
- a portion of the heat spreader plate extends between each open end and a closest one of the edges.
Dependencies are inferred from the claim text.