Cooling of electronic components in electronics servers
AssigneeAMD Design, LLC
InventorsPruthvik RAGHUPATHI, Sunilkumar PINNU, Sruti CHIGULLAPALLI
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Abstract
A system, apparatus, and method for cooling multiple electronics components that includes a plurality of heat spreaders where each heat spreader includes a first plate and a second plate. The first plate has a first body portion configured to form a thermal transfer relationship with a first side of a first electronic component. The second plate has a second body portion configured to form a thermal transfer relationship with a second side of the first electronic component. The heat spreader has an extending member extending to and overlapping with a portion of a cold plate arranged to cool a second electronics component.
Claims20
An apparatus comprising:
- a body formed of thermally conductive material configured to be in a first thermally conductive relationship with a first electronic component;
- and
- an extending member projecting from the body to extend to and overlap with a portion of a cold plate arranged to cool a second electronics component, the extending member further configured to be in a second thermally conductive relationship with with the cold plate.
A method of cooling electronic components comprising:
- providing a plurality of heat spreaders, wherein each heat spreader comprises a first plate and a second plate, wherein the first plate has a first body portion configured to cover and correlate with at least a portion of a surface contour of a first side of a first electronic component and the second plate has a second body portion configured to cover and correlate with at least a portion of a surface contour of a second side of a second electronic component, and wherein at least one extension extending from the first plate, the second plate, and combinations of the first plate and the second plate form an extending member that extends to and overlaps with a cold plate;
- positioning each of the plurality of heat spreaders so that:
- the first plate covers and forms a thermally conductive relationship with the first side of the first electronic component;
- the second plate covers and forms a thermally conductive relationship with the second side of the first electronic component;
- and the extending member extends to, overlaps with, and forms a thermally conductive relationship with the cold plate;
- supplying liquid coolant to the cold plate;
- and
- providing an air flow so that air flows along and in contact with the plurality of heat spreaders and the cold plate.
A system for cooling multiple electronic components, the system comprising a plurality of heat spreaders,
- wherein each heat spreader comprises:
- a first plate and a second plate, wherein,
- the first plate comprises a first body portion configured to at least substantially cover, conform to an outer surface shape of, and form a thermally conductive relationship with a first side of a first electronic component;
- and
- the second plate comprises a second body portion configured to at least substantially cover, conform to an outer shape of, and form a thermally conductive relationship with a second side of the first electronic component, and
- wherein at least one of the first plate comprises a first extension and the second plate comprises a second extension that form an extending member extending to and overlapping with a portion of a cold plate arranged to cool a second electronics component, the extending member further comprising a bottom surface configured to be in a thermally conductive relationship with the cold plate.
Dependencies are inferred from the claim text.