Vertical power supply assembly and smart card assembly with integrated heat sink
AssigneeMetaPWR Electronics Co., Ltd.
InventorsJianhong ZENG, Shouyu HONG
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Abstract
A vertical power supply assembly includes multiple vertical power supply modules and a vertical heat dissipation device. In scenarios where vertical power supply is implemented, the heat dissipation of the vertical power supply modules is achieved through the vertical heat dissipation device. The present application further provides a smart card assembly including a smart card mainboard, an XPU chip, an XPU substrate, the vertical power supply modules, a main heat dissipation device, and the vertical heat dissipation device; the vertical heat dissipation device and the main heat dissipation device are connected to rapidly and effectively dissipate heat from a bottom surface of the smart card mainboard.
Claims20
A vertical power supply assembly, comprising a vertical heat dissipation device and a plurality of vertical power supply modules, wherein the vertical power supply modules are connected in parallel and configured to supply power to an XPU chip;
- wherein the vertical power supply modules are disposed at vertical corresponding positions relative to the XPU chip;
- wherein a gap exists between every two adjacent vertical power supply modules,
- wherein the vertical heat dissipation device comprises a heat conduction structure;
- and wherein the thermal conduction structure is disposed within the gap and/or on an outer side of the vertical power supply module.
A smart card assembly integrating a heat sink, comprising a smart card mainboard, an XPU chip, an XPU substrate, a vertical power supply module, a main heat dissipation device, and a vertical heat dissipation device, wherein the XPU chip is disposed on a top surface of the XPU substrate, the XPU substrate is disposed on a top surface of the smart card mainboard;
- the vertical power supply module is disposed on a bottom surface of the smart card mainboard, wherein the vertical power supply module and the XPU chip are disposed in vertical correspondence, the XPU chip and the vertical power supply module are electrically connected via the XPU substrate and the smart card mainboard;
- wherein the main heat dissipation device is disposed on a top surface of the XPU chip and is thermally connected to the XPU chip;
- the vertical heat dissipation device is disposed on a bottom surface of the vertical power supply module;
- the vertical heat dissipation device comprises a thermal conduction structure, the thermal conduction structure is thermally connected to a side surface of the vertical power supply module.
Dependencies are inferred from the claim text.