H05K 7/20436
Inner thermal coupling elements in heat dissipating housings
Official title: {Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing}
H05K7/20436 (Inner thermal coupling elements in heat dissipating housings) appears on 1,893 US grants and 2,415 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,893
- Published applications
- 2,415
- Assignees
- 940
- Inventors
- 5,124
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 9 | 0 |
| 1987 | 9 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 8 | 0 |
| 1994 | 8 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 16 | 0 |
| 1999 | 13 | 0 |
| 2000 | 18 | 0 |
| 2001 | 15 | 5 |
| 2002 | 16 | 22 |
| 2003 | 19 | 22 |
| 2004 | 21 | 18 |
| 2005 | 12 | 36 |
| 2006 | 25 | 38 |
| 2007 | 27 | 38 |
| 2008 | 20 | 40 |
| 2009 | 19 | 43 |
| 2010 | 30 | 55 |
| 2011 | 25 | 62 |
| 2012 | 34 | 54 |
| 2013 | 37 | 73 |
| 2014 | 43 | 98 |
| 2015 | 67 | 84 |
| 2016 | 66 | 101 |
| 2017 | 87 | 99 |
| 2018 | 108 | 138 |
| 2019 | 133 | 142 |
| 2020 | 145 | 170 |
| 2021 | 126 | 172 |
| 2022 | 127 | 169 |
| 2023 | 141 | 188 |
| 2024 | 143 | 236 |
| 2025 | 174 | 174 |
| 2026 | 95 | 138 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Vehicle-mounted power supply apparatus with upper and lower cooling channels and vehicle6 Oct 2026US 12,757,361 B2Huawei Digital Power Technologies Co., Ltd.
- Brushless DC motor power tool with combined PCB design29 Sep 2026US 12,749,945 B2Milwaukee Electric Tool Corporation
- Package structure29 Sep 2026US 12,750,978 B2TMY Technology Inc.
- Server29 Sep 2026US 12,750,980 B2Bitmain Technologies Inc.
- Electrical connection unit8 Oct 2026US 2026/0312347 A1Yazaki Corporation
- High-power direct current charging system1 Oct 2026US 2026/0296235 A1ABB E-mobility B.V.
- Heat-dissipating structure1 Oct 2026US 2026/0302702 A1Resonac Corporation
- Laminated graphene-based thermally conductive film and pad and method for manufacturing the film and pad1 Oct 2026US 2026/0304707 A1SHT Smart High-Tech AB
- System and method for compression mechanism for cooling loop to a data processing system1 Oct 2026US 2026/0304711 A1Dell Products L. P.
Most cited
By later US patents
- Electronic device806US 9,313,915 B2ASUSTek · 2016
- Photovoltaic connection system281US 7,291,036 B1Tyco Electronics Corporation · 2007
- Optical network unit215US 5,267,122 AAlcatel Network Systems, Inc. · 1993
- Conformable pad with thermally conductive additive for heat dissipation179US 5,060,114 AZenith Electronics Corporation · 1991
- Microprocessor heat dissipation apparatus for a printed circuit board163US 5,272,599 ACompaq Computer Corporation · 1993