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US 2026/0302702 A1Published application
Heat-dissipating structure
AssigneeResonac Corporation
InventorsYui YAMAGUCHI, Takahiro YAMASHITA, Kazutake FUJISAWA, Seiichi ITO, Hiroaki SHODA, Yuji FUKUKAWA, Dai TSUNODA
Life of this patent
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Abstract
A heat-dissipating structure includes a conductive member; and a cooling and heating member, in which an adhesive layer and an insulating layer are provided between the conductive member and the cooling and heating member.
Claims9
A heat-dissipating structure, comprising a conductive member;
- and a cooling and heating member,
- wherein an adhesive layer and an insulating layer are provided between the conductive member and the cooling and heating member.
Dependencies are inferred from the claim text.