H05K 7/20445
The coupling element being an additional piece
Official title: {the coupling element being an additional piece, e.g. thermal standoff}
H05K7/20445 (The coupling element being an additional piece) appears on 1,135 US grants and 1,488 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,135
- Published applications
- 1,488
- Assignees
- 672
- Inventors
- 3,460
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 14 | 0 |
| 1999 | 7 | 0 |
| 2000 | 13 | 0 |
| 2001 | 10 | 4 |
| 2002 | 11 | 13 |
| 2003 | 16 | 18 |
| 2004 | 18 | 15 |
| 2005 | 9 | 26 |
| 2006 | 19 | 29 |
| 2007 | 15 | 24 |
| 2008 | 11 | 25 |
| 2009 | 14 | 32 |
| 2010 | 20 | 43 |
| 2011 | 21 | 40 |
| 2012 | 25 | 37 |
| 2013 | 21 | 45 |
| 2014 | 27 | 50 |
| 2015 | 31 | 41 |
| 2016 | 30 | 50 |
| 2017 | 44 | 56 |
| 2018 | 49 | 79 |
| 2019 | 78 | 83 |
| 2020 | 78 | 108 |
| 2021 | 77 | 122 |
| 2022 | 87 | 123 |
| 2023 | 98 | 114 |
| 2024 | 91 | 124 |
| 2025 | 91 | 97 |
| 2026 | 50 | 90 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System for attaching a thermal interface material to a heat sink8 Sep 2026US 12,733,106 B2Dell Products L. P.
- Conductive connection through eyewear hinge1 Sep 2026US 12,724,293 B2Snap Inc.
- Methods and apparatus to cool hardware25 Aug 2026US 12,720,711 B2Intel Corporation
- Liquid metal based thermal interface material25 Aug 2026US 12,720,712 B2Lenovo (Singapore) Pte. Ltd.
- Electronic device comprising printed circuit board structure accommodating thermal interface material11 Aug 2026US 12,707,601 B2Samsung Electronics Co., Ltd.
- Electrical connection unit8 Oct 2026US 2026/0312347 A1Yazaki Corporation
- High-power direct current charging system1 Oct 2026US 2026/0296235 A1ABB E-mobility B.V.
- Laminated graphene-based thermally conductive film and pad and method for manufacturing the film and pad1 Oct 2026US 2026/0304707 A1SHT Smart High-Tech AB
- Control apparatus for vehicle1 Oct 2026US 2026/0304712 A1Hyundai Mobis Co., Ltd.
- Power distribution system, battery pack, and electrical device24 Sep 2026US 2026/0290947 A1Eve Energy Co., Ltd.
Most cited
By later US patents
- Electronic device806US 9,313,915 B2ASUSTek · 2016
- Photovoltaic connection system281US 7,291,036 B1Tyco Electronics Corporation · 2007
- Conformable pad with thermally conductive additive for heat dissipation179US 5,060,114 AZenith Electronics Corporation · 1991
- Microprocessor heat dissipation apparatus for a printed circuit board163US 5,272,599 ACompaq Computer Corporation · 1993
- Chassis system and method for holding and protecting electronic modules118US 8,873,238 B2The Boeing Company · 2014