Chassis system and method for holding and protecting electronic modules

A chassis system comprising:

• a body;
• a lid removably attached to the body such that when the lid is attached to the body a cavity within the body is completely enclosed by the body and the attached lid, the lid and the body made of at least one material that does not allow electromagnetic waves to enter the cavity;
• a plurality of spaced-apart thermally conductive rails attached to the body within the cavity;
• a backplane attached to the body or the lid;
• at least one electronic module contained within the cavity between the plurality of spaced-apart thermally conductive rails and in contact with the backplane;
• an electrically conductive connector attached to the body or lid, wherein the electrically conductive connector is in wired or wireless communication with the backplane for allowing electricity or data to flow between the electrically conductive connector and the backplane;
• and
• a thermoelectric layer and a shape memory alloy layer both attached to the lid or body, wherein the shape memory alloy layer is configured to generate heat when compressed and the thermoelectric layer is configured to convert the heat generated by the shape memory alloy layer into electricity.

A method of manufacturing a chassis comprising:

• forming a chassis comprising a body, a cavity within the body, and a lid such that when the lid is attached to the body the cavity is completely enclosed by the body and the lid;
• molding at least one electrical connector to the lid or the body;
• molding at least one module securement member to the lid or the body;
• attaching a backplane to the lid or the body;
• connecting, wired or wirelessly, the backplane to the at least one electrical connector to allow electricity or data to flow between the at least one electrical connector and the backplane;
• and
• attaching a thermoelectric layer and a shape memory alloy layer to the lid or body, with the shape memory alloy layer configured to generate heat when compressed and the thermoelectric layer configured to convert the heat generated by the shape memory alloy layer into electricity.