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US 12,720,711 B2Granted
Methods and apparatus to cool hardware
AssigneeIntel Corporation
InventorsShreekanth Murthy Muthigi, Casey Winkel, Chetan Maheshwari
Life of this patent
Estimating the term…
Abstract
Methods and apparatus are disclosed to cool hardware. An example apparatus to cool a hardware component includes a first substrate; a second substrate couplable to a chassis, the second substrate formed of a metal; and a plurality of malleable fins coupled between the first and second substrates, the malleable fins formed of a thermally conductive material.
Claims15
An apparatus to cool a hardware component, the apparatus comprising:
- a first substrate;
- a second substrate couplable to a chassis, the second substrate including a metal;
- and
- a plurality of malleable fins coupled between the first and second substrates, the malleable fins including a thermally conductive material, wherein the malleable fins are coupled to the first substrate at a region between ends of respective ones of the malleable fins, the region to extend across a portion of the first substrate.
1 more element
An apparatus to cool hardware, the apparatus comprising:
- a first substrate to couple to a first side of a circuit board that is different than a second side of the circuit board, the hardware coupled to the second side of the circuit board;
- a second substrate couplable to a chassis, the second substrate including metal;
- and
- a plurality of malleable fins coupled between the first and second substrates, the malleable fins including a thermally conductive material.
1 more element
Dependencies are inferred from the claim text.