H05K 7/20463
Filling compound
Official title: {Filling compound, e.g. potted resin}
H05K7/20463 (Filling compound) appears on 117 US grants and 151 published applications in this corpus.
Search patents in H05K- Granted patents
- 117
- Published applications
- 151
- Assignees
- 118
- Inventors
- 387
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 0 |
| 2003 | 2 | 1 |
| 2004 | 1 | 2 |
| 2005 | 2 | 6 |
| 2006 | 6 | 4 |
| 2007 | 2 | 3 |
| 2008 | 0 | 3 |
| 2009 | 1 | 2 |
| 2010 | 2 | 9 |
| 2011 | 2 | 3 |
| 2012 | 2 | 3 |
| 2013 | 2 | 5 |
| 2014 | 2 | 4 |
| 2015 | 6 | 6 |
| 2016 | 6 | 4 |
| 2017 | 0 | 3 |
| 2018 | 4 | 10 |
| 2019 | 11 | 6 |
| 2020 | 9 | 10 |
| 2021 | 7 | 7 |
| 2022 | 7 | 12 |
| 2023 | 6 | 10 |
| 2024 | 5 | 16 |
| 2025 | 10 | 8 |
| 2026 | 6 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power module assembly30 Jun 2026US 12,672,267 B2Delta Electronics, Inc.
- Small form factor transceiver module16 Jun 2026US 12,660,130 B2Bizlink International Corp.
- Electronic device including thermal interface material21 Apr 2026US 12,610,449 B2Samsung Electronics Co., Ltd.
- Circuit assembly24 Mar 2026US 12,588,165 B2Autonetworks Technologies, Ltd.
- Rotary hammer including mode-based motor direction control10 Feb 2026US 12,544,897 B2Milwaukee Electric Tool Corporation
- Heat dissipation module, heat dissipation fin, and manufacturing method thereof for increasing heat contact area24 Sep 2026US 2026/0293056 A1Jws Technology Co., Ltd.
- Cooling structure for electronic component10 Sep 2026US 2026/0271238 A1Sea Sonic Electronics Co., Ltd.
- Liquid heat conduction material, combination of members for producing heat conduction sheet, heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheet3 Sep 2026US 2026/0262199 A1Resonac Corporation
- Rotary hammer including mode-based motor direction control16 Jul 2026US 2026/0200060 A1Milwaukee Electric Tool Corporation
- Circuit Board Assembly, Electronic Device, and Method for Producing Circuit Board Assembly14 May 2026US 2026/0136512 A1Honor Device Co., Ltd.
Most cited
By later US patents
- Packaging electrical components116US 5,365,403 AVLT, Inc. · 1994
- Environmentally tuned circuit card assembly and method for manufacturing the same83US 7,095,615 B2Honeywell International Inc. · 2006
- Power module and production method thereof76US 7,057,896 B2Matsushita Electric Industrial Co., Ltd. · 2006
- Printed circuit board and heat sink arrangement66US 5,646,826 ANorthern Telecom Limited · 1997
- Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink64US 6,860,004 B2Matsushita Electric Industrial Co., Ltd. · 2005