Circuit assembly

A circuit assembly comprising:

• at least one heat-generating component that generates heat as a result of a current flowing therethrough;
• at least one metal plate connected to a connecting portion of the at least one heat-generating component, and having a heat-dissipating portion configured to come into thermal contact with an external heat-dissipation target;
• a case accommodating the at least one heat-generating component and the at least one metal plate, and having an opening portion that exposes the heat-dissipating portion of the at least one metal plate to an outside;
• and
• an insulating film sealing the opening portion of the case and fixed to the case,
• wherein the case includes an upper case and a lower case,
• the at least one heat-generating component is fixed to at least either the upper case or the lower case, the lower case has a placement surface to be placed on the heat-dissipation target, and the placement surface has the opening portion,
• the lower case has at least one positioning portion positioning the heat-dissipating portion of the at least one metal plate disposed in the opening portion such that the heat-dissipating portion is flush with the placement surface,
• the at least one metal plate has a connecting section connected to the connecting portion of the at least one heat-generating component, and
• the circuit assembly has at least one tolerance absorbing structure absorbing tolerances of the connecting section and the connecting portion at a connecting position when the heat-dissipating portion is positioned by the at least one positioning portion.