Power module and production method thereof

A power module comprising:

• a circuit board having first and second surfaces, each said first and second surfaces including plural first devices and plural second devices mounted thereto, said circuit board and said plural first and second devices constituting an electric power conversion circuit, said plural first devices each having a high heating value;
• first and second heat sinks mounted on the first and second surfaces of said circuit board, respectively;
• and
• first and second members mounted on the first and second surfaces of said circuit board, respectively, each said member having electrical insulation characteristics and high thermal conductivity, each said member having a first portion and a second portion,
• wherein said first member is disposed between said plural first and second devices and said first heat sink, and said second member is disposed between said plural first and second devices and said second heat sink,
• wherein said first portion of said first member adheres to each of said plural first devices for transferring heat from said plural first devices to said first heat sink, said second portion of said first member is spaced from and not in contact with said plural first and second devices and said circuit board, and said first member remains substantially uniform in thickness at said second portion of said first member, and
• wherein said first portion of said second member adheres to each of said plural first devices for transferring heat from said plural first devices to said second heat sink, said second portion of said second member is spaced from and not in contact with said plural first and second devices and said circuit board, and said second member remains substantially uniform in thickness at said second portion of said second member.