Small form factor transceiver module
AssigneeBizlink International Corp.
InventorsZhaojun Xu, Jinhua Meng
Life of this patent
Estimating the term…
Abstract
A small form factor transceiver module includes a base, a printed circuit board, a cover, a heatsink and an adhesive. The printed circuit board has a connecting terminal. The printed circuit board is sandwiched between the base and the cover. The cover has at least one first groove and a mounting surface away from the printed circuit board. The first groove is located on the mounting surface. The adhesive is connected between the mounting surface and the heatsink. The first groove is configured to accommodate an excessive portion of the adhesive.
Claims15
A small form factor transceiver module, comprising:
- a base;
- a printed circuit board having a connecting terminal;
- a cover, the printed circuit board being sandwiched between the base and the cover, the cover having at least one first groove, at least one second groove, and a mounting surface away from the printed circuit board, the at least one first groove and the at least one second groove being located on the mounting surface;
- a heatsink;
- and
- an adhesive connected between the mounting surface and the heatsink,
- wherein the at least one first groove is configured to accommodate an excessive portion of the adhesive,
- wherein the at least one first groove extends in a first direction, the at least one second groove extends in a second direction intersecting with the first direction, and the at least one second groove is configured to accommodate another excessive portion of the adhesive,
- wherein the cover comprises:
- a body, the mounting surface is located on the body;
- two sidewalls connected with the body, the mounting surface is located between the two sidewalls, the two sidewalls are configured to abut against the heatsink;
- and
- at least one stopper disposed on the mounting surface and located between the two sidewalls, the at least one stopper is configured to abut against the heatsink.
A small form factor transceiver module, comprising:
- a base;
- a printed circuit board having a connecting terminal;
- a cover, the printed circuit board being sandwiched between the base and the cover, the cover having at least one first groove and a mounting surface away from the printed circuit board, the at least one first groove being located on the mounting surface;
- a heatsink;
- and
- an adhesive connected between the mounting surface and the heatsink,
- wherein the at least one first groove is configured to accommodate an excessive portion of the adhesive,
- wherein the cover comprises a body and two sidewalls connected with the body, and the mounting surface is located on the body,
- wherein the heatsink comprises:
- a bottom plate, the adhesive is connected between the mounting surface and the bottom plate;
- a top plate;
- and
- a plurality of fins separated from each other and connected between the bottom plate and the top plate,
- wherein a width of the top plate is greater than a width of the bottom plate, and both of the top plate and the bottom plate are separated from both of the two sidewalls.
A small form factor transceiver module, comprising:
- a base;
- a printed circuit board having a connecting terminal;
- a cover, the printed circuit board being sandwiched between the base and the cover, the cover having a mesh of grooves and a mounting surface away from the printed circuit board, the mesh of grooves being located on the mounting surface;
- a heatsink;
- and
- an adhesive connected between the mounting surface and the heatsink,
- wherein the mesh of grooves is configured to accommodate an excessive portion of the adhesive,
- wherein the cover comprises:
- a body, the mounting surface is located on the body;
- two sidewalls connected with the body;
- and
- two stoppers disposed on the mounting surface forming an enclosure around the mounting surface with the two sidewalls,
- wherein the heatsink comprises a bottom plate and a top plate, a width of the top plate is greater than a width of the bottom plate, and both of the top plate and the bottom plate are separated from both of the two sidewalls.
Dependencies are inferred from the claim text.