Heat dissipation module, heat dissipation fin, and manufacturing method thereof for increasing heat contact area

Abstract

A heat dissipation module and its heat dissipation fin along with a manufacturing method for increasing a heat contact area are provided for use with a solder. The heat dissipation module includes a heat dissipation fin assembly and a heat pipe. The heat dissipation fin assembly includes heat dissipation fins spaced apart in parallel. A sheet body of each fin features a through-hole and one or more blind holes communicating with the through-hole. Each blind hole contains a continuous closed bottom wall, a semi-circular peripheral wall, and a communication port formed on one side of the semi-circular peripheral wall and communicating with the through-hole. The heat pipe is inserted through each through-hole. The solder may be placed in each blind hole and filled between the heat pipe and the inner periphery of each through-hole through each communication port, thereby enhancing the thermal conductivity of the heat dissipation module and fins.

Dependencies are inferred from the claim text.