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US 2026/0262199 A1Published application
Liquid heat conduction material, combination of members for producing heat conduction sheet, heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheet
AssigneeResonac Corporation
InventorsMika KOBUNE, Ricardo Mizoguchi Gorgoll
Life of this patent
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Abstract
A liquid heat conduction material has a thermal conductivity that is greater than or equal to 5 W/(m·K). The liquid heat conduction material is for forming a liquid layer by applying the material to at least a part of a heat conduction layer. The heat conduction layer contains heat conductive particles.
Claims15
A liquid heat conduction material having a thermal conductivity of 5 W/(m·K) or more, for forming a liquid layer by applying the material to at least a part of a heat conduction layer containing heat conductive particles.
Dependencies are inferred from the claim text.