H05K 7/20472
Sheet interfaces
Official title: {Sheet interfaces}
H05K7/20472 (Sheet interfaces) appears on 377 US grants and 554 published applications in this corpus.
Search patents in H05K- Granted patents
- 377
- Published applications
- 554
- Assignees
- 274
- Inventors
- 1,253
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 4 |
| 2003 | 3 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 6 |
| 2006 | 2 | 6 |
| 2007 | 3 | 7 |
| 2008 | 2 | 4 |
| 2009 | 3 | 13 |
| 2010 | 9 | 15 |
| 2011 | 7 | 18 |
| 2012 | 10 | 6 |
| 2013 | 7 | 18 |
| 2014 | 8 | 18 |
| 2015 | 14 | 17 |
| 2016 | 10 | 16 |
| 2017 | 13 | 21 |
| 2018 | 14 | 31 |
| 2019 | 24 | 31 |
| 2020 | 29 | 48 |
| 2021 | 28 | 48 |
| 2022 | 39 | 53 |
| 2023 | 45 | 52 |
| 2024 | 34 | 47 |
| 2025 | 43 | 35 |
| 2026 | 20 | 36 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Liquid metal based thermal interface material25 Aug 2026US 12,720,712 B2Lenovo (Singapore) Pte. Ltd.
- Thermal conductive element and electronic device4 Aug 2026US 12,701,676 B2Lenovo (Beijing) Limited
- Heat radiation structure, electronic apparatus, and method for manufacturing same21 Jul 2026US 12,690,169 B2Lenovo (Singapore) Pte. Ltd.
- Abrasion-resistant coatings for thermal interfaces21 Jul 2026US 12,690,170 B2Henkel AG & Co. KGaA
- Cooling system for a wireless power transmitter and receiver and method of using same7 Jul 2026US 12,677,397 B2Aptiv Technologies AG
- Electrical connection unit8 Oct 2026US 2026/0312347 A1Yazaki Corporation
- Laminated graphene-based thermally conductive film and pad and method for manufacturing the film and pad1 Oct 2026US 2026/0304707 A1SHT Smart High-Tech AB
- Power distribution system, battery pack, and electrical device24 Sep 2026US 2026/0290947 A1Eve Energy Co., Ltd.
- Scaled-capacity embodiment of a material-driven thermal management architecture17 Sep 2026US 2026/0282272 A1
- Cooling structure for electronic component10 Sep 2026US 2026/0271238 A1Sea Sonic Electronics Co., Ltd.
Most cited
By later US patents
- Cooled electrical system for use downhole86US 5,931,000 A1999
- Solid state data storage assembly69US 8,199,506 B2Seagate Technology LLC · 2012
- Thermal solution for portable electronic devices59US 7,292,441 B2Advanced Energy Technology Inc. · 2007
- Thermal interface material having a zone-coated release linear51US 6,644,395 B1Parker-Hannifin Corporation · 2003
- Cooling system for multichip module41US 6,219,236 B1Fujitsu Limited · 2001