Solid state data storage assembly

A solid state drive assembly comprising:

• at least one printed circuit board assembly;
• a housing substantially enclosing the printed circuit board assembly with a space between the printed circuit board assembly and the housing, the printed circuit board assembly comprising a printed circuit board with electrical components attached thereon;
• and
• first and second layers of shock absorbing and thermally conductive material positioned between the housing and the printed circuit board assembly, wherein the first and second layers of the thermally conductive material contacts the housing and substantially covers first and second major surfaces of the printed circuit board assembly and fills the space between the housing and the printed circuit board assembly, wherein the solid state assembly is capable of withstanding an impact having an acceleration up to about 1500 G without detachment of any of the electrical components from the printed circuit board.

A method comprising:

• placing a printed circuit board assembly within a housing, wherein the printed circuit board assembly comprises at least one printed circuit board and at least one solid state memory component;
• placing a first layer of compressible, shock absorbing, thermally conductive material over a first surface of the printed circuit board assembly, the first layer substantially covering the first surface;
• placing a second layer of compressible, shock absorbing, thermally conductive material over a second surface of the printed circuit board assembly, the second layer substantially covering the second surface;
• attaching a first cover to the housing, including compressing the first layer of thermally conductive material between the first cover and a first surface of the printed circuit board assembly and filling a space between the attached first cover and the first surface of the printed circuit board assembly;
• and
• attaching a second cover to the housing, including compressing the second layer of thermally conductive material between the second cover and the second surface of the printed circuit board assembly and filling a space between the attached second cover and the second surface of the printed circuit board assembly.