H05K 7/20481
Characterised by the material composition exhibiting specific thermal properties
Official title: {characterised by the material composition exhibiting specific thermal properties}
H05K7/20481 (Characterised by the material composition exhibiting specific thermal properties) appears on 190 US grants and 300 published applications in this corpus.
Search patents in H05K- Granted patents
- 190
- Published applications
- 300
- Assignees
- 159
- Inventors
- 700
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 3 |
| 2007 | 0 | 4 |
| 2008 | 2 | 3 |
| 2009 | 2 | 3 |
| 2010 | 2 | 10 |
| 2011 | 3 | 8 |
| 2012 | 4 | 3 |
| 2013 | 6 | 13 |
| 2014 | 2 | 8 |
| 2015 | 8 | 12 |
| 2016 | 6 | 11 |
| 2017 | 5 | 13 |
| 2018 | 6 | 15 |
| 2019 | 13 | 18 |
| 2020 | 18 | 29 |
| 2021 | 12 | 27 |
| 2022 | 22 | 25 |
| 2023 | 20 | 24 |
| 2024 | 16 | 25 |
| 2025 | 26 | 21 |
| 2026 | 11 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Liquid metal based thermal interface material25 Aug 2026US 12,720,712 B2Lenovo (Singapore) Pte. Ltd.
- Abrasion-resistant coatings for thermal interfaces21 Jul 2026US 12,690,170 B2Henkel AG & Co. KGaA
- Cooling system for a wireless power transmitter and receiver and method of using same7 Jul 2026US 12,677,397 B2Aptiv Technologies AG
- Laminated graphene-based thermally conductive film and pad and method for manufacturing the film and pad30 Jun 2026US 12,672,262 B2SHT Smart High-Tech AB
- Display module and glass with undercut plastic frame23 Jun 2026US 12,663,832 B2Apple Inc.
- Laminated graphene-based thermally conductive film and pad and method for manufacturing the film and pad1 Oct 2026US 2026/0304707 A1SHT Smart High-Tech AB
- Scaled-capacity embodiment of a material-driven thermal management architecture17 Sep 2026US 2026/0282272 A1
- Cooling structure for electronic component10 Sep 2026US 2026/0271238 A1Sea Sonic Electronics Co., Ltd.
- A thermal strap and a method for manufacturing a thermal strap27 Aug 2026US 2026/0251409 A1
- Thermal Interface Material Assemblies13 Aug 2026US 2026/0235829 A1Laird Technologies (Shenzhen) Ltd.
Most cited
By later US patents
- Cooled electrical system for use downhole86US 5,931,000 A1999
- Thermal interface material having a zone-coated release linear51US 6,644,395 B1Parker-Hannifin Corporation · 2003
- Graphite film and graphite composite film34US 8,092,908 B2Kaneka Corporation · 2012
- High thermal conductivity heat transfer pad28US 6,542,371 B1Intel Corporation · 2003
- Cubic boron nitride composite structure24US 5,834,689 APCC Composites, Inc. · 1998