Thermal Interface Material Assemblies

A thermal interface material assembly comprising:

• a substrate having opposite first and second surfaces;
• an antifriction layer along the first surface of the substrate;
• and
• a thermal interface material along the second surface of the substrate, such that the substrate is between the antifriction layer and the thermal interface material;
• wherein the antifriction layer is configured to have a lower coefficient of friction than the substrate;
• wherein the thermal interface material has a higher thermal conductivity than each of the substrate and the antifriction layer;
• wherein an adhesive structure is disposed along edge portions of the thermal interface material, the adhesive structure including first and second adhesive segments along opposed edges parallel to a direction of sliding, the adhesive structure defines a channel that laterally confines the thermal interface material between the opposed edges, wherein the substrate overlies and spans the channel and the first and second adhesive segments to define a wear-resisting layer over the thermal interface material;
• whereby the antifriction layer is configured to slide along in contact with a first surface of a first component when the thermal interface material assembly is along a second surface of a second component such that the substrate and the antifriction layer along the first surface of the substrate intervenes between the first surface of the first component and the thermal interface material along the second surface of the substrate thereby preventing direct contact between the thermal interface material and the first surface of the first component when the first surface of the first component and the second surface of the second component are slidably moved relative to each other.

A thermal interface material assembly comprising:

• a substrate having opposite first and second surfaces;
• an antifriction layer along the first surface of the substrate;
• and
• a thermal interface material along the second surface of the substrate, such that the substrate is between the antifriction layer and the thermal interface material;
• wherein the antifriction layer is configured to have a lower coefficient of friction than the substrate;
• wherein the thermal interface material has a higher thermal conductivity than each of the substrate and the antifriction layer;
• wherein an adhesive structure including first and second adhesive segments along opposed edges of the thermal interface material parallel to a direction of sliding;
• whereby the antifriction layer is configured to slide along in contact with a first surface of a first component when the thermal interface material assembly is along a second surface of a second component such that the substrate and the antifriction layer along the first surface of the substrate intervenes between the first surface of the first component and the thermal interface material along the second surface of the substrate thereby preventing direct contact between the thermal interface material and the first surface of the first component when the first surface of the first component and the second surface of the second component are slidably moved relative to each other.