Cooled electrical system for use downhole

A cooled electronic system for use downhole in a drill string through which a drilling fluid flows, said cooled electronic system comprising:

• a) a housing adapted to be disposed within said drill string, whereby said drilling fluid flows over said housing;
• b) at least a first thermoelectric cooler, said fast thermoelectric cooler comprising (i) a hot plate on one side thereof, (ii) a cold plate on another side thereof, and (iii) means for transferring heat from said cold plate to said hot plate;
• c) a first electronic component, said first electronic component having at least a first surface, said first surface of said first electronic component being in heat flow communication with said cold plate of said first thermoelectric cooler, whereby said cold plate receives heat from said first electronic component and transfers said received heat to said hot plate;
• and
• d) a thermal conductor having first and second heat transfer surfaces, said first heat transfer surface of said thermal conductor being in heat flow communication with said hot plate, said second heat transfer surface of said thermal conductor being in heat flow communication with said housing, whereby said thermal conductor conducts heat from said hot plate to said housing, and whereby said housing transfers heat to said drilling fluid flowing over said housing.

A cooled electronic system for use in a well containing a fluid, said cooled electronic system comprising:

• a) a housing adapted to be disposed within said well, whereby said housing is exposed to said fluid and is in convective heat transfer therewith;
• b) a thermoelectric cooler, said thermoelectric cooler comprising (i) a hot plate on one side thereof, (ii) a cold plate on another side thereof, and (iii) means for transferring heat from said cold plate to said hot plate;
• c) an electronic component, said electronic component forming a first surface thereof, said first surface of said electronic component being in heat flow communication with said cold plate of said thermoelectric cooler, whereby said cold plate receives heat from said electronic component and transfers said received heat to said hot plate;
• and
• d) means for placing said hot plate of said thermoelectric cooler in conductive heat transfer communication with said housing, whereby heat from said hot plate is conducted to said housing and then transferred from said housing to said fluid by convective heat transfer, said conductive heat transfer means comprising a chassis on which said electronic component and said thermoelectric cooler are mounted.

A cooled electronic system for use in a well containing a fluid, said cooled electronic system comprising:

• a) a housing adapted to be disposed within said well, whereby said housing is exposed to said fluid and is in convective heat transfer therewith;
• b) a thermoelectric cooler, said thermoelectric cooler comprising (i) a hot plate on one side thereof, (ii) a cold plate on another side thereof, and (iii) means for transferring heat from said cold plate to said hot plate;
• c) an electronic component, said electronic component forming a first surface thereof, said first surface of said electronic component being in heat flow communication with said cold plate of said thermoelectric cooler, whereby said cold plate receives heat from said electronic component and transfers said received heat to said hot plate, either a thermoelectric cooler or a thermal insulator being disposed adjacent each surface of said electronic component so that none of the surfaces of said electronic component have neither an insulator or a thermoelectric cooler disposed adjacent therewith;
• and
• d) means for placing said hot plate of said thermoelectric cooler in conductive heat transfer communication with said housing, whereby heat from said hot plate is conducted to said housing and then transferred from said housing to said fluid by convective heat transfer.

A cooled electronic system for use in a well containing a fluid, said cooled electronic system comprising:

• a) a housing adapted to be disposed within said well, whereby said housing is exposed to said fluid and is in convective heat transfer therewith;
• b) a thermoelectric cooler, said thermoelectric cooler comprising (i) a hot plate on one side thereof, (ii) a cold plate on another side thereof, and (iii) means for transferring heat from said cold plate to said hot plate;
• c) an electronic component, said electronic component forming a first surface thereof, said first surface of said electronic component being in heat flow communication with said cold plate of said thermoelectric cooler, whereby said cold plate receives heat from said electronic component and transfers said received heat to said hot plate;
• and
• d) means for placing said hot plate of said thermoelectric cooler in conductive heat transfer communication with said housing, whereby heat from said hot plate is conducted to said housing and then transferred from said housing to said fluid by convective heat transfer, said conductive heat transfer means comprising said thermoelectric cooler being disposed between said electronic component and said housing so as to place said thermoelectric cooler in direct conductive heat flow communication with said housing, whereby heat flows from said electronic component to said thermoelectric cooler and then to said housing.

A cooled electronic system for use in a well containing a fluid, said cooled electronic system comprising:

• a) a housing adapted to be disposed within said well, whereby said housing is exposed to said fluid and is in convective heat transfer therewith, said housing having a surface, a layer of conformable material in contact with said housing surface and substantially conforming therewith;
• b) a thermoelectric cooler, said thermoelectric cooler comprising (i) a hot plate on one side thereof, (ii) a cold plate on another side thereof, and (iii) means for transferring heat from said cold plate to said hot plate;
• c) an electronic component, said electronic component forming a first surface thereof, said first surface of said electronic component being in heat flow communication with said cold plate of said thermoelectric cooler, whereby said cold plate receives heat from said electronic component and transfers said received heat to said hot plate;
• and
• d) means for placing said hot plate of said thermoelectric cooler in conductive heat transfer communication with said housing, whereby heat from said hot plate is conducted to said housing and then transferred from said housing to said fluid by convective heat transfer.