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US 5,834,689 AGranted
Cubic boron nitride composite structure
AssigneePCC Composites, Inc.
InventorArnold J. Cook
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AssigneePCC Composites, Inc.
InventorArnold J. Cook
Estimating the term…
The present invention pertains to a composite structure comprised of a matrix material, such as metal, and a plurality of cubic boron nitride particles dispersed within and surrounded by the matrix material. In a first embodiment, the composite structure is used as an electronic package to house an electrical device such as an integrated chip. The cubic boron nitride particles are dispersed within the matrix material in proportion such that the coefficient of thermal expansion of the package essentially matches that of the electronic devices. In another embodiment, the composite structure can be used as a thermal conductor, such as a heat sink. Since cubic boron nitride particles have the highest thermal conductivity of any ceramic, they act in combination with the matrix metal to transfer heat efficiently. In another embodiment, the composite structure can be used as a component subject to attrition. The cubic boron nitrides offer unexcelled wear resistance and transfer the heat efficiently.
A net shape composite article comprising:
A package for housing an electronic device comprising:
A net shape thermally conductive body comprising:
A net shape component subject to wear comprising:
A net shape composite structure comprising:
A thermal conductor comprising:
A net shape thermal conductor comprising:
A net shape component subject to wear comprising:
A composite article comprising:
A thermally conductive body comprising:
A component subject to wear comprising:
Dependencies are inferred from the claim text.