Server

A server, comprising:

• a server main body, comprising a chassis, a first circuit board assembly, and a heat dissipation fan assembly;
• the first circuit board assembly is installed in the chassis, and the heat dissipation fan assembly is installed on the chassis to dissipate heat of the first circuit board assembly;
• a power supply, installed on a side of the chassis;
• a heat conduction layer, arranged between the power supply and the chassis to conduct heat generated by the power supply to the chassis;
• wherein the power supply comprises a housing and a second circuit board assembly, the housing is provided with a cavity, and the second circuit board assembly is at least partially accommodated in the cavity, the second circuit board assembly is attached to the side of the chassis through the heat conduction layer, the housing is connected to the chassis and/or the second circuit board assembly, and the second circuit board assembly is electrically connected to the first circuit board assembly;
• wherein the cavity has an opening open to the chassis, the cavity is filled with a heat-conducting plastic sealing adhesive, and an end of the housing close to the opening is attached to the chassis and/or the second circuit board assembly to seal the cavity.