H05K 7/205
Heat-dissipating body thermally connected to heat generating element via thermal paths through
Official title: {Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201)}
H05K7/205 (Heat-dissipating body thermally connected to heat generating element via thermal paths through) appears on 345 US grants and 414 published applications in this corpus.
Search patents in H05K- Granted patents
- 345
- Published applications
- 414
- Assignees
- 269
- Inventors
- 1,063
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 2 |
| 2003 | 5 | 3 |
| 2004 | 6 | 1 |
| 2005 | 2 | 6 |
| 2006 | 3 | 3 |
| 2007 | 3 | 13 |
| 2008 | 7 | 14 |
| 2009 | 8 | 8 |
| 2010 | 7 | 10 |
| 2011 | 8 | 13 |
| 2012 | 7 | 11 |
| 2013 | 8 | 16 |
| 2014 | 9 | 13 |
| 2015 | 11 | 23 |
| 2016 | 19 | 26 |
| 2017 | 19 | 17 |
| 2018 | 15 | 9 |
| 2019 | 19 | 23 |
| 2020 | 14 | 24 |
| 2021 | 20 | 29 |
| 2022 | 21 | 41 |
| 2023 | 22 | 40 |
| 2024 | 34 | 34 |
| 2025 | 32 | 19 |
| 2026 | 14 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dual mode cooling system for use with in-wall video-codec and other electronic circuits22 Sep 2026US 12,745,364 B2Crestron Electronics, Inc.
- Heat dissipating assembly for circuit15 Sep 2026US 12,739,964 B2Schneider Electric (China) Co., Ltd.
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Electric component module11 Aug 2026US 12,707,600 B2Mitsubishi Electric Corporation
- Heterogenous multi-layer structure11 Aug 2026US 12,707,602 B2Tesla, Inc.
- Data throughput using a metal bracket8 Oct 2026US 2026/0313848 A1Micron Technology, Inc.
- Heat dissipation assembly, base plate and methods for the use and assembly thereof17 Sep 2026US 2026/0282299 A1DSP Solutions Inc.
- Mounting system for modularly constructed, electronically controllable sound transducer systems6 Aug 2026US 2026/0230735 A1Holoplot GmbH
- Optical coupling lens module and optical fiber connector30 Jul 2026US 2026/0219460 A1Connpro Industries Inc.
- Resin composition and heat-dissipating member30 Jul 2026US 2026/0223333 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Conforming heat sink assembly95US 4,974,119 AThe Charles Stark Draper Laboratories, Inc. · 1990
- Circuit board having improved thermal radiation82US 5,500,785 AFuji Xerox Co., Ltd. · 1996
- Apparatus for using an active circuit board as a heat sink80US 5,390,078 AAT&T Global Information Solutions Company · 1995
- Circuit board having improved thermal radiation70US 5,586,007 AFuji Xerox Co., Ltd. · 1996
- Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink64US 6,860,004 B2Matsushita Electric Industrial Co., Ltd. · 2005