Electric component module

An electric component module comprising:

• a substrate to include a first surface, a second surface facing an opposite side of the first surface, a first metal foil provided on the first surface, and a second metal foil provided on the second surface, in which a via hole that penetrates from the first surface to the second surface and electrically connects the first metal foil and the second metal foil is provided;
• a heat generating component disposed away from the substrate in a plate thickness direction of the substrate;
• a heat transfer resin to be disposed between the substrate and the heat generating component and have contact with the substrate and the heat generating component;
• a metal member disposed on an opposite side of the heat generating component with the substrate therebetween and disposed away from the substrate in the plate thickness direction of the substrate;
• a heat dissipation member to be disposed between the substrate and the metal member and have contact with the substrate and the metal member;
• and
• a metal heat transfer pin to be inserted into the via hole, wherein
• the first metal foil and the via hole are formed at positions overlapping at least the heat generating component as viewed along the plate thickness direction of the substrate, and
• a part of the heat transfer pin inserted into the via hole has contact with the heat transfer resin.