Resin composition and heat-dissipating member
AssigneeSekisui Chemical Co., Ltd.
InventorsTakahiro URAYAMA, Ryousuke TAKAHASHI, Osamu INUI, Hidehito NISHIZAWA, ASANO Motohiko, Tetsurou YOSHIOKA, Yuuto KAGE
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AssigneeSekisui Chemical Co., Ltd.
InventorsTakahiro URAYAMA, Ryousuke TAKAHASHI, Osamu INUI, Hidehito NISHIZAWA, ASANO Motohiko, Tetsurou YOSHIOKA, Yuuto KAGE
Estimating the term…
There is provided a resin composition containing a first filler that is at least one selected from the group consisting of octahedral diamond and hexoctahedral diamond, a second filler different from the first filler, and a matrix resin, wherein the volume-average particle diameter for primary particle diameter of the first filler is larger than the volume-average particle diameter for primary particle diameter of the second filler; the volume percentage of the whole of the fillers is higher than 80% by volume, and the volume percentage of the diamond is higher than 20% by volume; and the volume-average particle diameter for primary particle diameter of the first filler is 55 μm or larger.
A resin composition, comprising:
Dependencies are inferred from the claim text.