Heat dissipation assembly, base plate and methods for the use and assembly thereof
AssigneeDSP Solutions Inc.
InventorsAnthony T. D’Amore, Juan Rodriguez
Life of this patent
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AssigneeDSP Solutions Inc.
InventorsAnthony T. D’Amore, Juan Rodriguez
Estimating the term…
A heat dissipation assembly includes a heat sink having an exterior surface and an interior air flow passageway defining a longitudinal axis. The air flow passageway has an inlet and an outlet. A fan creates an air flow from the inlet to the outlet through the interior air flow passageway. A plurality of laterally spaced heat producing electronic component abut the exterior surface of the heat sink. A base plate includes a base portion and an air guide extending orthogonally from the base portion along the longitudinal axis. At least a portion of the air guide extends through the outlet and is disposed in the interior air flow passageway of the heat sink. An electronic assembly, such as an amplifier, a base plate and a method of dissipating heat are also disclosed.
A heat dissipation assembly comprising:
A base plate configured to guide air exiting a heat sink, the base plate comprising:
A method of dissipating heat from a plurality of heat producing electronic components comprising:
Dependencies are inferred from the claim text.