Heterogenous multi-layer structure

A method for cooling an electronic assembly comprising:

• mounting a first cooling system on top of and in thermal communication with a first electronics layer, wherein the first electronics layer includes an array of integrated circuit dies and wherein the first electronics layer includes conductive materials to interconnect the array of integrated circuit dies;
• mounting the first electronics layer on top of and in thermal communication with a second cooling system;
• and
• mounting the second cooling system on top of and in thermal communication with a second electronics layer,
• wherein the second electronics layer comprises an array of power delivery modules, each power delivery module of the array of power delivery modules electrically connected with and configured to supply power to a respective integrated circuit die of the array of integrated circuit dies,
• wherein the second cooling system comprises a first cooling inlet configured to receive a coolant and a first cooling outlet configured to remove the coolant from the second cooling system, and is configured to conduct thermal energy from the array of integrated circuit dies and the array of power delivery modules, and
• wherein each integrated circuit die of the array of integrated circuit dies is in electronic communication with each other in a plane that is orthogonal to power delivery from the array of power delivery modules.

A computing assembly comprising:

• a first cooling system;
• a first electronics layer in thermal communication with the first cooling system;
• a second cooling system in thermal communication with the first electronics layer;
• a second electronics layer in thermal communication with the second cooling system;
• a third cooling system in thermal communication with the second electronics layer;
• and
• a third electronics layer in thermal communication with the third cooling system,
• wherein the first electronics layer comprises a processing electronics layer comprising a plurality of mounted integrated circuit dies and wherein the first electronics layer includes conductive materials to interconnect the plurality of mounted integrated circuit dies,
• wherein the second electronics layer comprises a power delivery layer comprising an array of power delivery modules wherein the integrated circuit dies of the plurality of mounted integrated circuit dies are in electronic communication with each other in a plane that is orthogonal to power delivery from the array of power delivery modules and wherein each power delivery module of the array of power delivery modules is electrically connected with and configured to supply power to a respective integrated circuit die of the plurality of mounted integrated circuit dies,
• wherein the second cooling system comprises a first cooling inlet configured to receive a coolant and a first cooling outlet configured to remove the coolant from the second cooling system, and is configured to conduct thermal energy from plurality of mounted integrated circuit dies and the array of power delivery modules, and
• wherein the third electronics layer comprises a control electronics layer.