H05K 7/20409
Outer radiating structures on heat dissipating housings
Official title: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing}
H05K7/20409 (Outer radiating structures on heat dissipating housings) appears on 1,163 US grants and 1,638 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,163
- Published applications
- 1,638
- Assignees
- 709
- Inventors
- 3,696
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 7 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 4 |
| 2003 | 1 | 9 |
| 2004 | 9 | 10 |
| 2005 | 7 | 7 |
| 2006 | 7 | 8 |
| 2007 | 12 | 21 |
| 2008 | 9 | 30 |
| 2009 | 8 | 19 |
| 2010 | 13 | 24 |
| 2011 | 15 | 30 |
| 2012 | 12 | 25 |
| 2013 | 18 | 45 |
| 2014 | 24 | 56 |
| 2015 | 39 | 65 |
| 2016 | 58 | 72 |
| 2017 | 63 | 77 |
| 2018 | 84 | 101 |
| 2019 | 78 | 107 |
| 2020 | 122 | 91 |
| 2021 | 87 | 121 |
| 2022 | 83 | 127 |
| 2023 | 87 | 149 |
| 2024 | 114 | 166 |
| 2025 | 111 | 136 |
| 2026 | 62 | 137 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Connector assembly with improved heat dissipation effect6 Oct 2026US 12,756,145 B2Dongguan Luxshare Technologies Co., Ltd
- Enhanced optical module cooling with angled fins29 Sep 2026US 12,748,273 B2Ciena Corporation
- Dual mode cooling system for use with in-wall video-codec and other electronic circuits22 Sep 2026US 12,745,364 B2Crestron Electronics, Inc.
- Apparatuses and methods for liquid cooling a vehicle suspension component and wheel controller15 Sep 2026US 12,734,878 B2Hl Mando Corporation
- Vapor chamber having a reservoir15 Sep 2026US 12,736,291 B2Razer (Asia-Pacific) Pte. Ltd.
- Device and method for dissipating heat from an electronic component of a motor vehicle8 Oct 2026US 2026/0313855 A1
- Inverter and energy storage system including the same8 Oct 2026US 2026/0313856 A1Hanwha Solutions Corporation
- Heat sink, liquid discharge head, and liquid discharge apparatus1 Oct 2026US 2026/0296076 A1
- Cooling of electronic components in electronics servers1 Oct 2026US 2026/0304688 A1AMD Design, LLC
- Control apparatus for vehicle1 Oct 2026US 2026/0304712 A1Hyundai Mobis Co., Ltd.
Most cited
By later US patents
- Optical network unit215US 5,267,122 AAlcatel Network Systems, Inc. · 1993
- Thermal management for head-worn computer199US 9,423,842 B2Osterhout Group, Inc. · 2016
- Pluggable electronic module and receptacle with heat sink183US 6,816,376 B2Tyco Electronics Corporation · 2004
- Assembly for circuit modules122US 4,811,165 AMotorola, Inc. · 1989
- Transceiver and interface for IC package105US 8,588,561 B2Samtec, Inc. · 2013