H05K 7/20427
Having radiation enhancing surface treatment
Official title: {having radiation enhancing surface treatment, e.g. black coating}
H05K7/20427 (Having radiation enhancing surface treatment) appears on 36 US grants and 77 published applications in this corpus.
Search patents in H05K- Granted patents
- 36
- Published applications
- 77
- Assignees
- 55
- Inventors
- 185
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 6 |
| 2009 | 0 | 2 |
| 2010 | 0 | 1 |
| 2011 | 1 | 4 |
| 2012 | 0 | 2 |
| 2013 | 1 | 5 |
| 2014 | 2 | 3 |
| 2015 | 1 | 4 |
| 2016 | 2 | 3 |
| 2017 | 3 | 3 |
| 2018 | 4 | 3 |
| 2019 | 3 | 4 |
| 2020 | 4 | 3 |
| 2021 | 1 | 5 |
| 2022 | 2 | 3 |
| 2023 | 3 | 4 |
| 2024 | 0 | 6 |
| 2025 | 2 | 6 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and methods for installation of optical solar reflectors18 Aug 2026US 12,709,413 B2The Boeing Company
- Heat conducting member, optical module, heat sink, and method for preparing heat conducting member9 Jun 2026US 12,650,564 B2Huawei Technologies Co., Ltd.
- Heat dissipation for an information handling system24 Feb 2026US 12,563,703 B2Dell Products L. P.
- Thermal radiation heat dissipation device for electronic component and preparation method thereof9 Dec 2025US 12,495,526 B2National Tsing Hua University
- Structure with color-changing housing25 Nov 2025US 12,481,195 B2Milwaukee Electric Tool Corporation
- Apparatus and methods for installation of optical solar reflectors18 Jun 2026US 2026/0167361 A1The Boeing Company
- Automobile heat dissipation device having modified surface11 Jun 2026US 2026/0164622 A1Amulaire Thermal Technology, Inc.
- Electrical connection unit7 May 2026US 2026/0128559 A1Yazaki Corporation
- Motherboard structure and electronic device7 May 2026US 2026/0129788 A1ASRock Industrial Computer Corporation
- Structure with color-changing housing26 Feb 2026US 2026/0056441 A1Milwaukee Electric Tool Corporation
Most cited
By later US patents
- Enhanced heat transfer in printed circuit boards27US 5,898,570 ANorthrop Grumman Corporation · 1999
- Black-coated steel sheet, worked material, and panel for flat-panel television27US 8,715,837 B2Jfe Steel Corporation · 2014
- Enhanced heat transfer in printed circuit boards and electronic components thereof19US 5,852,548 ANorthrop Grumman Corporation · 1998
- Electronic device thermal management13US 7,957,131 B1Intel Corporation · 2011
- Electronic device, method for producing the same, and printed circuit board comprising electronic device7US 8,811,019 B2Schweizer Electronic AG · 2014