Electronic device, method for producing the same, and printed circuit board comprising electronic device

A printed circuit board, comprising:

• a) an electronic device;
• and
• b) the electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides, and with at least one electronic component arranged in a cutout of the first layer;
• wherein the first layer in each case and the at least one electronic component are covered with an electrically insulating, thermally conductive layer, and a further layer composed of electrically conductive material is provided in each case on the electrically insulating, thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and the electrically insulating, thermally conductive layer and the further layer furthermore comprising plated-through holes composed of the electrically conductive material of the covering layer, the plated-through holes extending through the electrically insulating, thermally conductive layer covering the at least one electronic component and the further layer composed of electrically and thermally conductive material for a purpose of making contact with the at least one electronic component.

A method for integrating an electronic device into a printed circuit board, comprising the steps of

• a) providing the electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides, and with at least one electronic component arranged in a cutout of the first layer;
• wherein the first layer in each case and the at least one electronic component are covered with an electrically insulating, thermally conductive layer, and a further layer composed of electrically conductive material is provided in each case on the electrically insulating, thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and the electrically insulating, thermally conductive layer and the further layer furthermore comprising plated-through holes composed of the electrically conductive material of the covering layer, the plated-through holes extending through the electrically insulating, thermally conductive layer covering the at least one electronic component and the further layer composed of electrically and thermally conductive material for a purpose of making contact with the at least one electronic component;
• b) providing the printed circuit board comprising a recess for receiving the electronic device;
• c) inserting a layer with low thermal conductivity into the recess;
• d) inserting the electronic device into the recess of the printed circuit board on the layer with low thermal conductivity;
• e) pressing together the layered structure created thereby;
• and
• f) applying an electrically conductive layer forming a common outer layer which also serves for contacting the electronic device with the printed circuit board.

A method of making an electronic device, comprising the following steps:

• a) making a first semi-finished product by
• i) providing a substrate of electrically conductive material with an upper side and a bottom side;
• ii) applying/depositing a first layer of conductive material on at least one of the upper side or the bottom side of the substrate, the first layer having at least one cutout, each cutout for receiving a respective one of at least one electronic component being provided in the first layer;
• and
• iii) inserting the respective one of the at least one electronic component in each of the at least one cutout;
• b) making a second semi-finished product by
• i) providing a first plate element of electrically conductive material;
• and
• ii) creating holes in the first plate element to subsequently form plated-through holes;
• c) arranging the two semi-finished products as a layered structure by placing the second semi-finished product on the first semi-finished product, with a prepreg resin layer being provided in between;
• d) laminating the structure;
• e) uncovering the holes in the first plate element filled with the resin after the laminating process;
• and
• f) at least partially filling the holes with conductive material for a purpose of forming the plated-through holes.

A method of making an electronic device, comprising the following steps:

• a) making a first semi-finished product by
• i) providing a substrate of electrically conductive material having an upper side and a bottom side;
• ii) applying a first layer of conductive material on at least one of the upper side or the bottom side of the substrate, the first layer having at least one cutout, each cutout for receiving a respective one of at least one electronic component being provided in the first layer;
• and
• iii) inserting the respective one of the at least one electronic component in each of the at least one cutout;
• b) making a second semi-finished product by
• i) providing a first plate element of electrically conductive material;
• and
• ii) creating holes in the first plate element to subsequently form plated-through holes;
• c) making a third semi-finished product by providing a second plate element of electrically conductive material;
• d) arranging the three semi-finished products as a layered structure by placing the first semi-finished product on the third semi-finished product, and by placing the second semi-finished product on the first semi-finished product, with at least one prepreg resin layer being provided in between, respectively;
• e) laminating the structure;
• f) uncovering the resin-filled holes of the first plate element after the step of laminating;
• and
• g) at least partially filling the holes with conductive material forming the plated-through holes and for a purpose of creating a contact.