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US 7,957,131 B1Granted
Electronic device thermal management
AssigneeIntel Corporation
InventorsRajiv K. Mongia, Mark MacDonald, Eduardo Hernandez-Pacheco, Jered H. Wikander
Life of this patent
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Abstract
An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.
Claims18
An electronic device, comprising:
- a housing;
- at least one heat generating component in the housing;
- at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing, and wherein the thermal management device comprises:
- a porous window formed in at least one section of the housing;
- and
- at least one patch formed from a material which transmits infrared radiation disposed proximate the porous window.
3 more elements
A computer system, comprising:
- a housing having an upper skin and a lower skin;
- a circuit board comprising at least one heat generating circuit component;
- and
- at least one infrared radiation management device in which selectively manages infrared radiation on one or more portions of the housing, and wherein the radiation management device comprises:
- a porous window formed in at least one section of the housing;
- and
- at least on patch formed from a material which transmits infrared radiation disposed proximate the porous window.
4 more elements
Dependencies are inferred from the claim text.